SK hynix Showcases Industry-Leading Memory Technology at GTC 2025

• Various memory products for AI data centers, on-device, automotive businesses on display

SEOUL, South Korea, March 19, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will participate in the GTC 2025, a global AI conference taking place March 17-21 in San Jose, California, with a booth titled "Memory, Powering AI and Tomorrow".

SK hynix HBM4 & SOCAMM

The company will present HBM and other memory products for AI data centers and on-device* and memory solutions for automotive business essential for AI era.

*On-device: a technology that implements certain functions on the device itself, instead of going through computation by a physically separated server. As for the on-device AI, a smart device's direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service

Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM**, a new memory standard for AI servers.

**SOCAMM(Small Outline Compression Attached Memory Module): a low-power DRAM-based memory module for AI server

At the event, top company executives led by Chief Executive Officer Kwak Noh-Jung, President, Head of AI Infra and Chief Marketing Officer Juseon (Justin) Kim and Head of Global S&M Lee Sangrak will meet with the leaders of the global AI industry to enhance collaboration.

Following the industry's first mass production and supply of the 12-high HBM3E, SK hynix is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within the second half for immediate start of supply to order. At GTC 2025, a model of the 12-high HBM4, which is under development, will also be displayed.

"We are proud to present our line-up of industry-leading products at GTC 2025," President & Head of AI Infra Juseon (Justin) Kim said. "With a differentiated competitiveness in the AI memory space, we are on track to bring our future as the Full Stack AI Memory Provider*** forward."